A semiconductor chip includes a substrate, a circuit formed over the substrate, a plurality of conductive pads formed over the substrate, and a plurality of bump structures each formed over a corresponding one of the plurality of conductive pads. The plurality of conductive pads includes a first conductive pad having a first pad width and a second conductive pad having a second pad width larger than the first pad width. The first conductive pad is electrically coupled to the circuit, and the second conductive pad is positioned at a corner region of the semiconductor chip and is free from being electrically coupled to the circuit. The first conductive pad is positioned closer to a geometric center of the semiconductor chip than the second conductive pad.