Enhanced WLP for superior temp cycling, drop test and high current applications

Invention Grant

US09099345B2 Enhanced WLP for superior temp cycling, drop test and high current applications 有权

Title translation: 增强的WLP，可实现卓越的温度循环，跌落测试和高电流应用

Patent Title: Enhanced WLP for superior temp cycling, drop test and high current applications
Patent Title (中): 增强的WLP，可实现卓越的温度循环，跌落测试和高电流应用
Application No.: US13608555

Application Date: 2012-09-10
Publication No.: US09099345B2

Publication Date: 2015-08-04
Inventor: Rey Alvarado , Tie Wang , Arkadii Samoilov
Applicant: Rey Alvarado , Tie Wang , Arkadii Samoilov
Applicant Address: US CA San Jose
Assignee: Maxim Integrated Products, Inc.
Current Assignee: Maxim Integrated Products, Inc.
Current Assignee Address: US CA San Jose
Agency: Advent, LLP
Main IPC: H01L23/48
IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00 ; H01L23/31

Abstract:

A WLP device is provided with a flange shaped UBM or an embedded partial solder ball UBM on top of a copper post style circuit connection.

Abstract(Chinese):

WLP器件在铜柱式电路连接的顶部设置有凸缘形UBM或嵌入式部分焊球UBM。

Public/Granted literature

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/48	.用于向或自处于工作中的固态物体通电的装置，例如引线或接线端装置