A semiconductor package includes a base, a die attached to the base, a lead and a connector electrically connecting the lead to the die. A mold compound encapsulates the die, the connector, at least part of the base, and part of the lead, so that the lead extends outward from the mold compound. An electrical insulation layer separate from the mold compound is attached to a surface of the mold compound over the connector. The electrical insulation layer has a fixed, defined thickness so that the package has a guaranteed minimum spacing between an apex of the connector and a surface of the electrical insulation layer facing away from the connector.