Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13406996Application Date: 2012-02-28
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Publication No.: US09099437B2Publication Date: 2015-08-04
- Inventor: Hideki Uochi
- Applicant: Hideki Uochi
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2011-050032 20110308
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/423 ; G11C11/403 ; H01L21/84 ; H01L27/108 ; H01L27/11 ; H01L27/115 ; H01L29/49 ; H01L29/786 ; G11C5/06 ; H01L27/12 ; G11C11/412 ; G11C16/04

Abstract:
A semiconductor device in which a semiconductor layer is formed over a gate electrode with a large aspect ratio, thereby obtaining a channel length of a transistor which hardly causes a short-channel effect even when the transistor is miniaturized. A lower electrode is provided under the gate electrode with an insulating layer provided therebetween so that the electrode overlaps with the semiconductor layer. A potential (electric field) of the lower electrode imparts a conductivity type to the semiconductor layer overlapping with the lower electrode, so that a source region and a drain region are formed in the semiconductor layer. The gate electrode serves as a shield, so that a region in the semiconductor layer, which faces the gate electrode with the gate insulating layer provided therebetween, is not influenced by the electric field from the lower electrode.
Public/Granted literature
- US20120228615A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-09-13
Information query
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