Invention Grant
- Patent Title: Method of forming a conductive polymer microstructure
- Patent Title (中): 形成导电聚合物微观结构的方法
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Application No.: US14032067Application Date: 2013-09-19
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Publication No.: US09099529B2Publication Date: 2015-08-04
- Inventor: Vincenza Di Palma , Andrea Di Matteo , Luigi Giuseppe Occhipinti
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed IP Law Group PLLC
- Priority: ITVI2012A0237 20120925
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L35/24 ; H01L29/00 ; H01L21/768 ; H01L21/321 ; H01L51/00 ; H01L51/05
Abstract:
The present disclosure relates to microstructure devices, in which a conductive pattern is formed on the basis of a conductive polymer material. In order to avoid the deposition and processing of the sacrificial materials and reduce a negative influence of the lithography process on sensitive conductive polymer materials a one-layer patterning sequence is proposed, in which a trench pattern is formed in a dielectric material that is subsequently filled with the conductive polymer material.
Public/Granted literature
- US20140087552A1 METHOD OF FORMING A CONDUCTIVE POLYMER MICROSTRUCTURE Public/Granted day:2014-03-27
Information query
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