Invention Grant
- Patent Title: Three-dimensional system-in-package architecture
- Patent Title (中): 三维系统级封装架构
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Application No.: US13864112Application Date: 2013-04-16
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Publication No.: US09099540B2Publication Date: 2015-08-04
- Inventor: Oscar M. K. Law , Kuo H. Wu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/768 ; H01L23/48 ; H01L23/00 ; H01L25/065 ; H01L25/00
Abstract:
A system and method for making semiconductor die connections with through-silicon vias (TSVs) are disclosed. A semiconductor die is manufactured with both via-first TSVs as well as via-last TSVs in order to establish low resistance paths for die connections between adjacent dies as well as for providing a low resistance path for feedthrough channels between multiple dies.
Public/Granted literature
- US20130230985A1 Three-Dimensional System-in-Package Architecture Public/Granted day:2013-09-05
Information query
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