Invention Grant
- Patent Title: Semiconductor device and method for manufacturing same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13709915Application Date: 2012-12-10
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Publication No.: US09099553B2Publication Date: 2015-08-04
- Inventor: Takeyoshi Masuda , Keiji Wada , Toru Hiyoshi
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Tamatane J. Aga
- Priority: JP2012-004641 20120113
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L29/66 ; H01L29/423 ; H01L29/10 ; H01L21/04 ; H01L29/417 ; H01L29/45 ; H01L29/04 ; H01L29/16 ; H01L21/3065

Abstract:
A MOSFET includes: a substrate having a first trench formed therein, the first trench opening on a side of one main surface; a gate insulating film; and a gate electrode. The substrate includes an n type source region, a p type body region, an n type drift region, and a p type deep region making contact with the body region and extending to a region deeper than the first trench. The first trench is formed such that a distance between the wall surface and the deep region increases with increasing distance from the main surface of the substrate.
Public/Granted literature
- US20130181229A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2013-07-18
Information query
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