Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13738471Application Date: 2013-01-10
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Publication No.: US09099560B2Publication Date: 2015-08-04
- Inventor: Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2012-010421 20120120; JP2012-010422 20120120; JP2012-010427 20120120
- Main IPC: H01L29/12
- IPC: H01L29/12 ; H01L27/12 ; H01L29/786 ; H01L29/66 ; H01L29/49

Abstract:
A photolithography process for forming an island-shaped semiconductor layer is omitted, and a transistor is formed by at least two photolithography processes: a photolithography process for forming a gate electrode (including a wiring or the like formed from the same layer as the gate electrode) and a photolithography process for forming a source electrode and a drain electrode (including a wiring or the like formed from the same layer as the source electrode and the drain electrode). By using electron beam exposure, a transistor in which a distance between the source electrode and the drain electrode (channel length) is short can be formed. For example, a transistor whose channel length is less than 50 nm can be obtained.
Public/Granted literature
- US20130187161A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-07-25
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