Invention Grant
- Patent Title: MEMS microphone
- Patent Title (中): MEMS麦克风
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Application No.: US14261633Application Date: 2014-04-25
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Publication No.: US09099569B2Publication Date: 2015-08-04
- Inventor: Sang Ho Lee , Yong Hyun Shim
- Applicant: BSE CO., LTD.
- Applicant Address: KR Incheon
- Assignee: BSE CO., LTD.
- Current Assignee: BSE CO., LTD.
- Current Assignee Address: KR Incheon
- Agency: Ladas & Parry LLP
- Priority: KR10-2013-0074918 20130627
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H04R19/04 ; B81B3/00 ; B81B7/00

Abstract:
A micro-electro mechanical system (MEMS) microphone includes: a printed circuit substrate; a MEMS chip that is combined with the printed circuit substrate and has a MEMS inner space; and a case that is combined with the printed circuit substrate, accommodates the MEMS chip, and forms an inner space that is separated from an external space, wherein the case is a double-type case including an inner case and an outer case, a medium acoustic path space is formed between the inner case and the outer case, and the printed circuit substrate includes a substrate acoustic path that connects the medium acoustic path space to the MEMS inner space of the MEMS chip so that external sound passing through the sound hole enters the MEMS inner space of the MEMS chip after passing through the medium acoustic path space.
Public/Granted literature
- US20150001648A1 MEMS MICROPHONE Public/Granted day:2015-01-01
Information query
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