Invention Grant
US09099627B2 Method for producing group III nitride semiconductor light-emitting device
有权
III族氮化物半导体发光元件的制造方法
- Patent Title: Method for producing group III nitride semiconductor light-emitting device
- Patent Title (中): III族氮化物半导体发光元件的制造方法
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Application No.: US13824286Application Date: 2011-07-12
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Publication No.: US09099627B2Publication Date: 2015-08-04
- Inventor: Shingo Totani , Masashi Deguchi , Miki Moriyama
- Applicant: Shingo Totani , Masashi Deguchi , Miki Moriyama
- Applicant Address: JP Kiyosu-Shi, Aichi-Ken
- Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee Address: JP Kiyosu-Shi, Aichi-Ken
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2010-216670 20100928; JP2011-126840 20110607
- International Application: PCT/JP2011/003981 WO 20110712
- International Announcement: WO2012/042713 WO 20120405
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/44 ; H01L33/46 ; H01L33/38

Abstract:
Sample A is produced by sequentially forming a first insulating film of SiO2 and a reflective film on a sapphire substrate. Sample B is produced by sequentially forming a first insulating film of SiO2, a reflective film, and a second insulating film of SiO2 on a sapphire substrate. In both samples A and B, the reflectance of the reflective film was measured at a wavelength of 450 nm before and after heat treatment. Heat treatment was performed at 600° C. for three minutes. As shown in FIG. 1, in Al/Ag/Al where Al has a thickness of 1 Å to 30 Å, Ag/Al where Al has a thickness of 20 Å, and Al/Ag/Al/Ag/Al where Al has a thickness of 20 Å, the reflectance was 95% or more, which is equivalent to or higher than that of Ag even after the heat treatment.
Public/Granted literature
- US20130203194A1 METHOD FOR PRODUCING GROUP III NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE Public/Granted day:2013-08-08
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