Invention Grant
- Patent Title: Phase change memory and method of fabricating the phase change memory
- Patent Title (中): 相变存储器和相变存储器的制造方法
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Application No.: US14228765Application Date: 2014-03-28
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Publication No.: US09099637B2Publication Date: 2015-08-04
- Inventor: Yun Heub Song
- Applicant: Intellectual Discovery Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: INTELLECTUAL DISCOVERY CO., LTD.
- Current Assignee: INTELLECTUAL DISCOVERY CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2013-0033663 20130328; KR10-2013-0033665 20130328; KR10-2013-0033666 20130328
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
Provided is a phase change memory, including: at least one wiring layer each including a first conductive layer and a phase change layer horizontally disposed on the first conductive layer; a heater layer disposed to vertically contact with the at least one wiring layer; and a second conductive layer disposed to contact with the heater layer in parallel therewith, and through which current flows from at least one electrode into the at least one wiring layer. The phase change layer may be made of a phase change material and may have a thickness less than a thickness of the first conductive layer.
Public/Granted literature
- US20140291603A1 PHASE CHANGE MEMORY AND METHOD OF FABRICATING THE PHASE CHANGE MEMORY Public/Granted day:2014-10-02
Information query
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