Invention Grant
- Patent Title: Encapsulation process and structure for electronic devices
- Patent Title (中): 电子设备的封装过程和结构
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Application No.: US12791810Application Date: 2010-06-01
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Publication No.: US09099679B2Publication Date: 2015-08-04
- Inventor: John Devin MacKenzie , Yuko Nakazawa , Eric Jones
- Applicant: John Devin MacKenzie , Yuko Nakazawa , Eric Jones
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Chemical Company Limited
- Current Assignee: Sumitomo Chemical Company Limited
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H01L51/52 ; H01L23/26

Abstract:
Electronic devices, such as photovoltaic, transistor or doped light-emitting devices, can be manufactured with an air-based manufacturing process and device structure that encapsulates the device with air-stable electrodes and active layers that are reasonably stable in their unexcited state. A sheet of flexible material may act as a substrate and a second sheet of material acts as a cover. Getter materials are included in the encapsulated device, with the getter latent or unreactive during the manufacturing process.
Public/Granted literature
- US20100300746A1 ENCAPSULATION PROCESS AND STRUCTURE FOR ELECTRONIC DEVICES Public/Granted day:2010-12-02
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