Invention Grant
- Patent Title: Electronics module with a side entry connection
- Patent Title (中): 电子模块具有侧面入口连接
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Application No.: US14030671Application Date: 2013-09-18
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Publication No.: US09099820B2Publication Date: 2015-08-04
- Inventor: Robert C. Beer
- Applicant: DELPHI TECHNOLOGIES, INC.
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Lawrence D. Hazelton
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H05K5/00

Abstract:
An electronics module that includes a printed circuit board (PCB), a connector, a housing with a shroud, and an interposer. The PCB defines a plane of the PCB. The connector is coupled to the PCB to form a circuit board assembly (CBA). The connector includes a plurality of header pins oriented perpendicular to the plane. The housing is configured to receive the CBA. The housing is configured to define an opening in a wall of the housing proximate to the connector when the CBA is installed. The wall is characterized as perpendicular to the plane. The interposer is configured to couple to the housing. The interposer includes a plurality of mating pins oriented parallel to the plane. Each of the mating pins defines a forked end configured to make electrical contact with each of the header pins when the interposer is inserted into the opening.
Public/Granted literature
- US20150079813A1 ELECTRONICS MODULE WITH A SIDE ENTRY CONNECTION Public/Granted day:2015-03-19
Information query