Invention Grant
- Patent Title: Printed wiring board and method of manufacturing printed wiring board
- Patent Title (中): 印刷电路板及制造印刷线路板的方法
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Application No.: US13742669Application Date: 2013-01-16
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Publication No.: US09101048B2Publication Date: 2015-08-04
- Inventor: Tsukasa Nakanishi , Atsushi Nakamura , Takayuki Matsumoto
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: JP2012-016710 20120130
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/11 ; H05K7/20 ; H05K1/02 ; H05K3/00 ; H01L25/075
Abstract:
A printed wiring board includes an insulative substrate, a wiring portion which is formed on a surface of the insulative substrate and has a predetermined wiring pattern, an insulative layer which is formed on the wiring portion and on which a part of the wiring layer is exposed as a terminal, a radiator plate provided on another surface of the insulative substrate, and a heat conductive portion which is formed inside the through hole penetrating through the surface and the other surface of the insulative substrate and connected to the wiring portion.
Public/Granted literature
- US20130192880A1 PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD Public/Granted day:2013-08-01
Information query
