Invention Grant
- Patent Title: Method of measuring a three-dimensional shape
- Patent Title (中): 测量三维形状的方法
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Application No.: US13860298Application Date: 2013-04-10
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Publication No.: US09101055B2Publication Date: 2015-08-04
- Inventor: Min-Young Kim , Bong-Ha Hwang
- Applicant: KOH YOUNG TECHNOLOGY INC.
- Applicant Address: JP Seoul
- Assignee: KOH YOUNG TECHNOLOGY INC.
- Current Assignee: KOH YOUNG TECHNOLOGY INC.
- Current Assignee Address: JP Seoul
- Agency: Kile Park Reed & Houtteman PLLC
- Priority: KR10-2008-0100003 20081013
- Main IPC: H05K1/02
- IPC: H05K1/02 ; G01B11/25 ; G01B11/28 ; G06T7/00 ; G01N21/956 ; G06T7/60

Abstract:
In order to measure a three-dimensional shape, feature information is read from a database. A board is transferred to a measurement position. A measurement head is transferred to an inspection area of the board. Light of a first lighting device for three-dimensional measurement and light of a second lighting device for two-dimensional measurement is illuminated onto the inspection area to photograph a first reflection image and a second reflection image that are reflected from the inspection area. The inspection area is realigned by comparing the feature information with at least one of the photographed first and second reflection images to inspect distortion of the inspection area. The realigned inspection area is inspected. Thus, the three-dimensional shape may be precisely measured.
Public/Granted literature
- US20130229509A1 METHOD OF MEASURING A THREE-DIMENSIONAL SHAPE Public/Granted day:2013-09-05
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