Invention Grant
- Patent Title: Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
- Patent Title (中): 叠层体,层压板,多层叠板,印刷线路板以及层叠板的制造方法
-
Application No.: US13624124Application Date: 2012-09-21
-
Publication No.: US09101061B2Publication Date: 2015-08-04
- Inventor: Masahiro Aoshima , Yoshihiro Takahashi , Yuka Yamazaki , Yasuo Kamigata , Hikari Murai
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch Even Tabin & Flannery
- Priority: JP2012-200930 20120912
- Main IPC: H05K1/03
- IPC: H05K1/03 ; B32B17/06

Abstract:
A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer includes a resin composition containing a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate body. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer includes a cured product of the resin composition. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate including a cured resin layer forming step of forming the cured resin layer on the surface of a glass substrate.
Public/Granted literature
Information query