Invention Grant
US09101061B2 Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate 有权
叠层体,层压板,多层叠板,印刷线路板以及层叠板的制造方法

Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
Abstract:
A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer includes a resin composition containing a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate body. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer includes a cured product of the resin composition. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate including a cured resin layer forming step of forming the cured resin layer on the surface of a glass substrate.
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