Invention Grant
- Patent Title: Electronic component package with a heat conductor
- Patent Title (中): 带导热体的电子元件封装
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Application No.: US13722282Application Date: 2012-12-20
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Publication No.: US09101077B2Publication Date: 2015-08-04
- Inventor: Jean-Michel Riviere , Karine Saxod
- Applicant: STMicroelectronics (Grenoble 2) SAS
- Applicant Address: FR Grenoble
- Assignee: STMicroelectronics (Grenoble 2) SAS
- Current Assignee: STMicroelectronics (Grenoble 2) SAS
- Current Assignee Address: FR Grenoble
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/34 ; G01F1/20 ; G06F1/20
Abstract:
An electronic component package includes a support and heat conductor. The heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced.
Public/Granted literature
- US20130155620A1 Package Public/Granted day:2013-06-20
Information query
