Invention Grant
- Patent Title: Laser processing method
- Patent Title (中): 激光加工方法
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Application No.: US12094209Application Date: 2006-11-16
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Publication No.: US09102005B2Publication Date: 2015-08-11
- Inventor: Kenichi Muramatsu , Takeshi Sakamoto
- Applicant: Kenichi Muramatsu , Takeshi Sakamoto
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP2005-340635 20051125
- International Application: PCT/JP2006/322870 WO 20061116
- International Announcement: WO2007/060878 WO 20070531
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/16 ; B23K26/40 ; B28D5/00 ; H01L21/78 ; H01L21/683

Abstract:
A laser processing method which can prevent an object to be processed from being cut along a line to cut from a modified region acting as a cutting start point when separating a suction table and a holding member from each other is provided. An expandable tape 23 holding an object to be processed 1 while being stuck to a frame 51 is secured by suction onto a suction table 52 of a vacuum chuck with a porous sheet 53 interposed therebetween. Since the sheet 53 has a Young's modulus lower than that of the table 52, the tape 23 is restrained from biting into fine pores of the sheet 53. As a consequence, even when the table 52 and tape 23 are separated from each other by releasing the suction securing after forming a modified region 7, no strong bending stress acts on the object 1. This can prevent the object 1 from being cut along a line to cut from the modified region 7 acting as a cutting start point when separating the table 52 and tape 23 from each other.
Public/Granted literature
- US20090008373A1 Laser Processing Method Public/Granted day:2009-01-08
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