Invention Grant
US09102040B2 Low free formaldehyde phenolic resins for abrasive products 有权
用于研磨产品的低游离甲醛酚醛树脂

  • Patent Title: Low free formaldehyde phenolic resins for abrasive products
  • Patent Title (中): 用于研磨产品的低游离甲醛酚醛树脂
  • Application No.: US13876489
    Application Date: 2011-09-30
  • Publication No.: US09102040B2
    Publication Date: 2015-08-11
  • Inventor: Armin Tumler
  • Applicant: Armin Tumler
  • Applicant Address: FI Helsinki
  • Assignee: Dynea Chemicals Oy
  • Current Assignee: Dynea Chemicals Oy
  • Current Assignee Address: FI Helsinki
  • Agency: Hoyng Monegier LLP
  • Agent Ramin Amirsehhi; David P. Owen
  • Priority: GB1016565.2 20101001
  • International Application: PCT/EP2011/067181 WO 20110930
  • International Announcement: WO2012/042040 WO 20120405
  • Main IPC: B24D3/28
  • IPC: B24D3/28 C08G8/28 C09G1/02
Low free formaldehyde phenolic resins for abrasive products
Abstract:
The present invention provides process for the manufacture of an aqueous resin composition comprising a phenolic formaldehyde (PF) resin, which process comprises the steps of providing a formaldehyde and phenolic compound, reacting the compounds in a condensation reaction in the presence of a catalyst, after completion of the condensation reaction to react with free formaldehyde, determining the free formaldehyde content of the resin composition, adding a pre-calculated substantially stoichiometric amount of modifying compound containing a primary amine group to reduce the amount of free formaldehyde in the resin composition to less than 0.1 wt % (relative to the total weight of the aqueous resin composition), and optionally distillation of the reaction product.
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