Invention Grant
- Patent Title: Low free formaldehyde phenolic resins for abrasive products
- Patent Title (中): 用于研磨产品的低游离甲醛酚醛树脂
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Application No.: US13876489Application Date: 2011-09-30
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Publication No.: US09102040B2Publication Date: 2015-08-11
- Inventor: Armin Tumler
- Applicant: Armin Tumler
- Applicant Address: FI Helsinki
- Assignee: Dynea Chemicals Oy
- Current Assignee: Dynea Chemicals Oy
- Current Assignee Address: FI Helsinki
- Agency: Hoyng Monegier LLP
- Agent Ramin Amirsehhi; David P. Owen
- Priority: GB1016565.2 20101001
- International Application: PCT/EP2011/067181 WO 20110930
- International Announcement: WO2012/042040 WO 20120405
- Main IPC: B24D3/28
- IPC: B24D3/28 ; C08G8/28 ; C09G1/02

Abstract:
The present invention provides process for the manufacture of an aqueous resin composition comprising a phenolic formaldehyde (PF) resin, which process comprises the steps of providing a formaldehyde and phenolic compound, reacting the compounds in a condensation reaction in the presence of a catalyst, after completion of the condensation reaction to react with free formaldehyde, determining the free formaldehyde content of the resin composition, adding a pre-calculated substantially stoichiometric amount of modifying compound containing a primary amine group to reduce the amount of free formaldehyde in the resin composition to less than 0.1 wt % (relative to the total weight of the aqueous resin composition), and optionally distillation of the reaction product.
Public/Granted literature
- US20130232884A1 LOW FREE FORMALDEHYDE PHENOLIC RESINS FOR ABRASIVE PRODUCTS Public/Granted day:2013-09-12
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