Invention Grant
- Patent Title: Mould assembly and method of closing a mould assembly
- Patent Title (中): 模具组装和关闭模具组件的方法
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Application No.: US13810996Application Date: 2011-02-07
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Publication No.: US09102082B2Publication Date: 2015-08-11
- Inventor: Karsten Schibsbye
- Applicant: Karsten Schibsbye
- Applicant Address: DE München
- Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee Address: DE München
- Priority: EP10007577 20100721
- International Application: PCT/EP2011/051726 WO 20110207
- International Announcement: WO2012/010331 WO 20120126
- Main IPC: B29C33/26
- IPC: B29C33/26 ; B29C31/00 ; B29C33/34 ; B29C33/22

Abstract:
A mold assembly includes a first mold part with a first mold opening and a second mold part with a second mold opening. The first mold part and the second mold part are separate parts. A rotating device rotates the second mold part from a position in which the second mold opening faces upwards to a position in which the second mold opening faces downwards. A moving device moves the first mold part and/or the second mold part relative to each other such that the second mold part is located above the first mold part. A closing device moves the first mold part and the second mold part towards each other with the first and second mold openings facing each other until the first and second mold parts engage. Further, a method of closing a mold assembly is provided.
Public/Granted literature
- US20130119582A1 MOULD ASSEMBLY AND METHOD OF CLOSING A MOULD ASSEMBLY Public/Granted day:2013-05-16
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