Invention Grant
US09102511B2 Hermetic plastic molded MEMS device package and method of fabrication
有权
密封塑料模制MEMS器件封装及其制造方法
- Patent Title: Hermetic plastic molded MEMS device package and method of fabrication
- Patent Title (中): 密封塑料模制MEMS器件封装及其制造方法
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Application No.: US13914013Application Date: 2013-06-10
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Publication No.: US09102511B2Publication Date: 2015-08-11
- Inventor: Virgil C. Ararao
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Frank D. Cimino
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B7/00
Abstract:
A hermetically packaged microelectromechanical system (MEMS) device has a substrate with an assembly pad (101) and a plurality of terminals (102); a chip (110) with a MEMS mechanical element (111) of a first height (111a) assembled on the pad and connected to the terminals by wires (120) with an insulating coat (121); a ridge (130) on the substrate, which surrounds the MEMS element (111) with a second height (130c) greater than the first height and comprises a plastic compound (131) filled with particles (132) and a surface (130a, 130b) having an adhering moisture-impermeable seal layer (133); and a moisture-impervious lid (140) attached to the ridge by moisture-proof bonds (150, 151), sealing the volume (160) enclosed by the lid, the chip, and the metalized ridge as a hermetic space for the MEMS element (111).
Public/Granted literature
- US20130328141A1 HERMETIC PLASTIC MOLDED MEMS DEVICE PACKAGE AND METHOD OF FABRICATION Public/Granted day:2013-12-12
Information query
