Invention Grant
- Patent Title: Carbon material covered with diamond thin film and method of manufacturing same
- Patent Title (中): 用金刚石薄膜覆盖的碳材料及其制造方法
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Application No.: US13260065Application Date: 2010-03-19
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Publication No.: US09102541B2Publication Date: 2015-08-11
- Inventor: Takanori Kawano , Rie Tao
- Applicant: Takanori Kawano , Rie Tao
- Applicant Address: JP Osaka
- Assignee: TOYO TANSO CO., LTD.
- Current Assignee: TOYO TANSO CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2009-070037 20090323
- International Application: PCT/JP2010/054768 WO 20100319
- International Announcement: WO2010/110196 WO 20100930
- Main IPC: B32B9/00
- IPC: B32B9/00 ; C01B31/06 ; C23C16/02 ; C23C16/27

Abstract:
A carbon material and a method of manufacturing the carbon material are provided. By affixing diamond particles onto a carbonaceous substrate in a condition in which etching caused by hydrogen radicals is unlikely to occur, the substrate etching rate can be suppressed, and the carbon material is allowed to have a diamond thin film having excellent adhesion capability. The carbon material has a carbonaceous substrate showing a weight decrease under a diamond synthesis condition, diamond particles disposed on a surface of the carbonaceous substrate, and a diamond layer having the diamond particles as seeds. The weight of the diamond particles per unit area is set to from 1.0×10−4 g/cm2 to less than 3.0×10−3 g/cm2.
Public/Granted literature
- US20120094117A1 CARBON MATERIAL COVERED WITH DIAMOND THIN FILM AND METHOD OF MANUFACTURING SAME Public/Granted day:2012-04-19
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