Invention Grant
- Patent Title: Flexible circuit board and method for manufacturing the same, and LED flexible strip light
- Patent Title (中): 柔性电路板及其制造方法，以及LED柔性条灯
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Application No.: US14506000Application Date: 2014-10-03
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Publication No.: US09103513B2Publication Date: 2015-08-11
- Inventor: Ben Fan
- Applicant: HE SHAN LIDE ELECTRONIC ENTERPRISE COMPANY LTD.
- Applicant Address: CN Heshan
- Assignee: Heshan Tongfang Lighting Technology Company Limited
- Current Assignee: Heshan Tongfang Lighting Technology Company Limited
- Current Assignee Address: CN Heshan
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: CN201320660256U 20131024; CN201310564102 20131114; CN201320736188U 20131119; CN201310627837 20131129; CN201320883675U 20131227; CN201410174783 20140428
- Main IPC: F21V21/00
- IPC: F21V21/00 ; F21S4/00 ; F21V21/14 ; F21K99/00 ; F21V7/00 ; F21V23/00 ; H05K3/10 ; F21Y101/02
Abstract:
A flexible circuit board is disclosed, including a first insulation layer, a second insulation layer and a circuit layer, wherein the first insulation layer is attached to one side of the circuit layer and the second insulation layer is attached to the other side of the circuit layer, each of the first insulation layer and the second insulation layer is provided with a foldable portion along their length, the foldable portion of the first insulation layer is corresponding in position with the foldable portion of the second insulation layer, and the circuit layer includes a set of power wires and at least one lighting wire. And a method for manufacturing the flexible circuit board, and a LED flexible strip light are also disclosed.
Public/Granted literature
- US20150117001A1 FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, AND LED FLEXIBLE STRIP LIGHT Public/Granted day:2015-04-30
Information query
