Invention Grant
- Patent Title: Termination trench for power MOSFET applications
- Patent Title (中): 用于功率MOSFET应用的端接沟槽
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Application No.: US13776523Application Date: 2013-02-25
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Publication No.: US09105494B2Publication Date: 2015-08-11
- Inventor: Yeeheng Lee , Madhur Bodbe , Daniel Calafut , Hamza Yilmaz , Xiaobin Wang , Ji Pan , Hong Chang , Jongoh Kim
- Applicant: Alpha and Omega Semiconductor Incorporated
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha and Omega Semiconductors, Incorporated
- Current Assignee: Alpha and Omega Semiconductors, Incorporated
- Current Assignee Address: US CA Sunnyvale
- Agency: JDI Patent
- Agent Joshua D. Isenberg
- Main IPC: H01L21/82
- IPC: H01L21/82 ; H01L27/088

Abstract:
Aspects of the present disclosure describe a termination structure for a power MOSFET device. A termination trench may be formed into a semiconductor material and may encircle an active area of the MOSFET. The termination trench may comprise a first and second portion of conductive material. The first and second portions of conductive material are electrically isolated from each other. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
Public/Granted literature
- US20140239388A1 TERMINATION TRENCH FOR POWER MOSFET APPLICATIONS Public/Granted day:2014-08-28
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