Invention Grant
- Patent Title: Semiconductor component and corresponding production method
- Patent Title (中): 半导体元件及相应的生产方法
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Application No.: US13577761Application Date: 2010-12-20
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Publication No.: US09105649B2Publication Date: 2015-08-11
- Inventor: Ricardo Ehrenpfordt
- Applicant: Ricardo Ehrenpfordt
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Maginot, Moore & Beck LLP
- Priority: DE102010001711 20100209
- International Application: PCT/EP2010/070278 WO 20101220
- International Announcement: WO2011/098187 WO 20110818
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L21/56 ; B81B7/00 ; H01L23/31 ; H01L23/00 ; H01L25/065 ; H01L25/16

Abstract:
A semiconductor component includes a substrate, a molded package, and a semiconductor chip. The semiconductor chip is suspended on the molding compound above the substrate in the molded package in such a way that a cavity mechanically decouples the semiconductor chip from the substrate. The cavity extends along an underside facing the substrate.
Public/Granted literature
- US20130193530A1 Semiconductor Component and Corresponding Production Method Public/Granted day:2013-08-01
Information query
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