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US09105649B2 Semiconductor component and corresponding production method 有权
半导体元件及相应的生产方法

Semiconductor component and corresponding production method
Abstract:
A semiconductor component includes a substrate, a molded package, and a semiconductor chip. The semiconductor chip is suspended on the molding compound above the substrate in the molded package in such a way that a cavity mechanically decouples the semiconductor chip from the substrate. The cavity extends along an underside facing the substrate.
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