Invention Grant
- Patent Title: Stepped elastic positioning structure for a semiconductor carrier
- Patent Title (中): 用于半导体载体的步进弹性定位结构
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Application No.: US14071640Application Date: 2013-11-04
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Publication No.: US09105674B2Publication Date: 2015-08-11
- Inventor: Yu-Nan Lo
- Applicant: Yu-Nan Lo
- Agency: Patent Office of Bang Shia
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B65D5/50 ; B65D1/36 ; H01L21/673

Abstract:
A stepped elastic positioning structure for a semiconductor carrier includes a plurality of transversely and longitudinally arranged walls and a plurality of recesses defined by the walls. On the walls of the semiconductor carrier is formed a plurality of L-shaped stop blocks, each of the stop blocks has an elastically deformable free end which is capable of elastically restricting the semiconductor in the recess, and improving the easiness for putting in or taking out the semiconductor. The end of each of the stop blocks is a stepped structure, plus the elastic deformability of the stop blocks, which makes the recess capable of holding different sized semiconductors.
Public/Granted literature
- US20150122698A1 Stepped Elastic Positioning Structure for a Semiconductor Carrier Public/Granted day:2015-05-07
Information query
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