Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US14265860Application Date: 2014-04-30
-
Publication No.: US09105743B2Publication Date: 2015-08-11
- Inventor: Taiji Ema , Kazushi Fujita , Junji Oh
- Applicant: FUJITSU SEMICONDUCTOR LIMITED
- Applicant Address: JP Yokohama
- Assignee: FUJITSU SEMICONDUCTOR LIMITED
- Current Assignee: FUJITSU SEMICONDUCTOR LIMITED
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-220774 20100930
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/8234 ; H01L21/761 ; H01L27/092 ; H01L29/10 ; H01L21/265 ; H01L29/66 ; H01L29/78

Abstract:
The semiconductor device includes a first transistor including a first impurity layer containing boron or phosphorus, a first epitaxial layer formed above the first impurity layer, a first gate electrode formed above the first epitaxial layer with a first gate insulating film formed therebetween and first source/drain regions, and a second transistor including a second impurity layer containing boron and carbon, or arsenic or antimony, a second epitaxial layer formed above the second impurity layer, a second gate electrode formed above the second epitaxial layer with a second gate insulating film thinner than the first gate insulating film formed therebetween, and second source/drain regions.
Public/Granted literature
- US20140235022A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2014-08-21
Information query
IPC分类: