The present invention is curable silicone resin composition which is an addition-curable silicone composition, and comprises: (A) (A-1) a compound having at least two aliphatic unsaturated groups per one molecule and represented by the following formula (1), (B) an organic silicon compound having at least two hydrogen atoms bonded to silicon atom per one molecule and having no aliphatic unsaturated group, (C) a hydrosilylation catalyst containing a platinum group metal, and (D) 0.1 to 500 parts by mass of silicone powder having an average particle diameter of 0.5 to 100 μm based on 100 parts by mass of the total Components (A) and (B). Thereby, there can be provided a curable silicone resin composition having high light extraction efficiency and useful as, for example, an encapsulant, a cured product thereof and a photosemiconductor apparatus.