Invention Grant
US09105953B2 High frequency line to waveguide converter comprising first and second dielectric layers sandwiching an antenna with an adhesion layer 有权
高频线对波导转换器包括用粘合层夹住天线的第一和第二电介质层

  • Patent Title: High frequency line to waveguide converter comprising first and second dielectric layers sandwiching an antenna with an adhesion layer
  • Patent Title (中): 高频线对波导转换器包括用粘合层夹住天线的第一和第二电介质层
  • Application No.: US13607328
    Application Date: 2012-09-07
  • Publication No.: US09105953B2
    Publication Date: 2015-08-11
  • Inventor: Koichiro Gomi
  • Applicant: Koichiro Gomi
  • Applicant Address: JP Tokyo
  • Assignee: Kabushiki Kaisha Toshiba
  • Current Assignee: Kabushiki Kaisha Toshiba
  • Current Assignee Address: JP Tokyo
  • Agency: Patterson & Sheridan, LLP
  • Priority: JPP2011-218757 20110930
  • Main IPC: H01P5/107
  • IPC: H01P5/107
High frequency line to waveguide converter comprising first and second dielectric layers sandwiching an antenna with an adhesion layer
Abstract:
A high frequency line-waveguide converter is provided which includes a first substrate including a first dielectric layer, a first conductive layer formed on a surface of the first dielectric layer, and a conductive pattern formed on the surface of the first dielectric layer that surrounds the second conductive layer. An antenna formed on a bottom surface of the first dielectric layer at a fixed interval from the second conductive layer. The high frequency line-waveguide converter also includes a second substrate including a third conductive layer and a fourth conductive layer separated by a second dielectric layer. An adhesion layer formed between the first substrate and second substrate, a shield conductive part formed by multiple vias between the conductive pattern and the fourth conductive layer, and a conductive waveguide in contact with the fourth conductive layer.
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