Invention Grant
US09105989B2 Connection structure, wiring substrate unit, electronic circuit part unit, and electronic apparatus
有权
连接结构，布线基板单元，电子电路部件单元和电子设备
- Patent Title: Connection structure, wiring substrate unit, electronic circuit part unit, and electronic apparatus
- Patent Title (中): 连接结构，布线基板单元，电子电路部件单元和电子设备
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Application No.: US13867188Application Date: 2013-04-22
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Publication No.: US09105989B2Publication Date: 2015-08-11
- Inventor: Kei Murayama , Shinji Nakazawa , Miki Suzuki
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: JP2012-103130 20120427
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01R12/00 ; H01R4/02 ; H05K3/34 ; H01L21/48 ; H01L23/00 ; H01L23/498
Abstract:
A connection structure includes a column electrode; a first connecting portion connected to one end of the column electrode; and a second connecting portion connected to another end of the column electrode via solder, wherein a height of the column electrode is a width of the first connecting portion or greater.
Public/Granted literature
- US20130284509A1 CONNECTION STRUCTURE, WIRING SUBSTRATE UNIT, ELECTRONIC CIRCUIT PART UNIT, AND ELECTRONIC APPARATUS Public/Granted day:2013-10-31
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