Invention Grant
- Patent Title: Device and method for modulating transmission of terahertz waves
- Patent Title (中): 调制太赫兹波传输的装置和方法
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Application No.: US14113728Application Date: 2012-05-03
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Publication No.: US09106342B2Publication Date: 2015-08-11
- Inventor: Quinfan Xu , Jie Shu , Daniel M. Mittleman , Ciyuan Qiu
- Applicant: Quinfan Xu , Jie Shu , Daniel M. Mittleman , Ciyuan Qiu
- Applicant Address: US TX Houston
- Assignee: William Marsh Rice University
- Current Assignee: William Marsh Rice University
- Current Assignee Address: US TX Houston
- Agency: Osha Liang LLP
- International Application: PCT/US2012/036289 WO 20120503
- International Announcement: WO2012/151380 WO 20121108
- Main IPC: H04B10/40
- IPC: H04B10/40 ; G01J5/08 ; H04B10/50 ; B82Y20/00 ; G02F1/025 ; H01Q15/00

Abstract:
A device for modulating terahertz waves includes a metal layer (703) including a continuous metal portion (705) and island metal portions (707). The metal portions (705, 707) are separated by apertures (709). The device further includes a semiconductor layer (715) affixed to a bottom surface of the metal layer (703). The semiconductor layer (715) includes carrier regions (717) located below the apertures (709). The transmission of terahertz waves through the apertures (709) is modulated by changing a voltage applied across the aperture via voltage source (715). By injecting free carriers into carrier regions (717) due to a change of the voltage an extraordinary terahertz transmission effect of the metal layer (703) can be switched off. A small increase in the free-carrier absorption is significantly enhanced by the Fabry-Perot resonance, resulting in a substantial decrease in transmission. The disclosed ring aperture terahertz modulator allows for electrical control of the carrier density only in the area underneath the aperture. This design minimizes the power consumption and maximizes the operation speed.
Public/Granted literature
- US20140048710A1 DEVICE AND METHOD FOR MODULATING TRANSMISSION OF TERAHERTZ WAVES Public/Granted day:2014-02-20
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