Invention Grant
- Patent Title: Earphones
- Patent Title (中): 耳机
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Application No.: US14214395Application Date: 2014-03-14
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Publication No.: US09106996B2Publication Date: 2015-08-11
- Inventor: Seth D. Burgett , Aaron Gorga , Effrosini A. Karayiannis
- Applicant: Harman International Industries, Incorporated
- Applicant Address: US CT Stamford
- Assignee: Harman International Industries, Incorporated
- Current Assignee: Harman International Industries, Incorporated
- Current Assignee Address: US CT Stamford
- Agency: Brooks Kushman P.C.
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R5/033

Abstract:
An earphone includes a generally conical housing having generally circular front face adapted to be seated in the concha of the user's ear. The housing tapers away from the front face toward the rear of the housing. A speaker is disposed in the housing. A first resilient portion is disposed on the sidewall of the housing to form a first contact surface. A second resilient portion is disposed on the sidewall of the housing, opposite from the first resilient portion. The second resilient portion extends sufficiently circumferentially around the housing to form second and third contact surfaces disposed on opposite sides of the wire guide. The first, second, and third contact surfaces allow the housing to be grasped between the thumb and two fingers of the user to facilitate insertion of the front portion of the housing into the user's ear.
Public/Granted literature
- US20140270315A1 EARPHONES Public/Granted day:2014-09-18
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