A behind-the-ear mountable earphone includes a generally C-shaped ear support. The support has a first section extending between a first end and the top of the “C”, adapted to fit behind the user's ear, and a second section extending from the top of the “C” to a second end. The second section is in a plane different from the first section, so that when the first section is behind the user's ear, the second section extends over the front of the user's ear. An earphone is telescopingly mounted on the second end of the C-shaped support. The earphone comprising a generally circular face adapted to be received in the concha of the user's ear, the generally circular face disposed at an angle with respect to the first section of the generally C-shaped support.