Invention Grant
- Patent Title: Integration panel
- Patent Title (中): 集成面板
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Application No.: US13777275Application Date: 2013-02-26
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Publication No.: US09107086B2Publication Date: 2015-08-11
- Inventor: Eric Leimeister , David Vucich , Dean Zavadsky , Philip M. Wala
- Applicant: ADC Telecommunications, Inc.
- Applicant Address: US PA Berwyn
- Assignee: ADC Telecommunications, Inc.
- Current Assignee: ADC Telecommunications, Inc.
- Current Assignee Address: US PA Berwyn
- Agency: Fogg & Powers LLC
- Main IPC: H04W24/00
- IPC: H04W24/00 ; H04W88/08 ; H04W92/04 ; H04W24/04 ; H04W24/08

Abstract:
An integration panel comprises a control module, a plurality of radio frequency (RF) modules, and a backplane configured to couple the plurality of RF modules to the control module. Each of the plurality of RF modules is configured to be coupled to a respective network device and to a host unit of a distributed antenna system. Each RF module is further configured to condition the RF signals received from the respective network device and to provide the conditioned RF signals to the host unit. Each of the RF modules is configured to sample the conditioned RF signals and to provide the sampled RF signals to the control module via the backplane. The control module is configured to perform signal analysis of the sampled RF signals and to provide the results of the signal analysis to a user device located remotely from the integration panel.
Public/Granted literature
- US20140022914A1 INTEGRATION PANEL Public/Granted day:2014-01-23
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