Invention Grant
- Patent Title: Package structure and stacked package module with the same
- Patent Title (中): 封装结构和堆叠封装模块相同
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Application No.: US14230941Application Date: 2014-03-31
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Publication No.: US09107290B1Publication Date: 2015-08-11
- Inventor: Da-Jung Chen
- Applicant: Delta Electronics Int'l (Singapore) Pte Ltd
- Applicant Address: SG Singapore
- Assignee: DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- Current Assignee: DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Kirton McConkie
- Agent Evan R. Witt
- Priority: SG10201400396W 20140305
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H05K3/00 ; H05K1/02

Abstract:
A package structure includes two insulation layers, three conductive layers, and two electronic components. The first and second conductive layers are disposed on a top surface and a bottom surface of the first insulation layer, respectively. The second insulation layer is disposed over the first conductive layer. The third conductive layer is disposed on a top surface of the second insulation layer. The first and second electronic components are embedded within the first and second insulation layers, respectively. The first conducting terminals of the first electronic component are electrically connected with the first conductive layer and the second conductive layer through at least one first conductive via and at least one second conductive via. The second conducting terminals of the second electronic component are electrically connected with the first conductive layer and/or electrically connected with the third conductive layer through at least one third conductive via.
Information query
IPC分类: