Invention Grant
US09107304B2 Fabrication of three-dimensional printed circuit board structures 有权
三维印刷电路板结构的制作

Fabrication of three-dimensional printed circuit board structures
Abstract:
A method of fabricating components for a three-dimensional circuit structure includes providing a printed circuit board (PCB) having a top surface, an opposing bottom surface, and an end section. A first angled channel is formed in the top surface at the end section, with the first angled channel extending to an edge of the end section and dividing the end section into a first end portion and a second end portion. The PCB material is removed from the top surface at the first end portion to form a first support member having an upper surface at a preselected distance below the top surface. A second angled channel is formed in the bottom surface at the end section of the first PCB, with the second angled channel extending to the edge of the end section and being adjacent to the first support member. The PCB material is removed from the bottom surface at the second end portion to form a second support member having an upper surface that is contiguous with the top surface of the PCB. A ramp portion extends between the first support member and the second support member.
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