Invention Grant
- Patent Title: Fabrication of three-dimensional printed circuit board structures
- Patent Title (中): 三维印刷电路板结构的制作
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Application No.: US13508257Application Date: 2011-11-18
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Publication No.: US09107304B2Publication Date: 2015-08-11
- Inventor: Nigel Wang , Orville Nyhus
- Applicant: Nigel Wang , Orville Nyhus
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Fogg & Powers LLC
- International Application: PCT/CN2011/082471 WO 20111118
- International Announcement: WO2013/071519 WO 20130523
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/02 ; H05K3/36 ; H05K1/11 ; H05K3/00

Abstract:
A method of fabricating components for a three-dimensional circuit structure includes providing a printed circuit board (PCB) having a top surface, an opposing bottom surface, and an end section. A first angled channel is formed in the top surface at the end section, with the first angled channel extending to an edge of the end section and dividing the end section into a first end portion and a second end portion. The PCB material is removed from the top surface at the first end portion to form a first support member having an upper surface at a preselected distance below the top surface. A second angled channel is formed in the bottom surface at the end section of the first PCB, with the second angled channel extending to the edge of the end section and being adjacent to the first support member. The PCB material is removed from the bottom surface at the second end portion to form a second support member having an upper surface that is contiguous with the top surface of the PCB. A ramp portion extends between the first support member and the second support member.
Public/Granted literature
- US20140238724A1 FABRICATION OF THREE-DIMENSIONAL PRINTED CIRCUIT BOARD STRUCTURES Public/Granted day:2014-08-28
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