An electronics module includes a module housing having a base structure and a plurality of side walls. A module cover contacts the side walls and is connected to the module housing via at least one fastener. The module housing includes at least one fastener boss for receiving the at least one fastener. Each of the fastener bosses includes a fastener hole protruding partially into the fastener boss and a vent hole connecting the fastener hole to an opening on a surface of the fastener boss exterior to the module housing, and a sealant disposed in the fastener boss, thereby preventing external air from entering the electronics module through a fastener connection.