Invention Grant
- Patent Title: Method of manufacturing a hybrid heat-radiating substrate
- Patent Title (中): 制造混合散热基板的方法
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Application No.: US14133157Application Date: 2013-12-18
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Publication No.: US09107313B2Publication Date: 2015-08-11
- Inventor: Chang Hyun Lim , Jung Eun Kang , Heung Soo Park , Seog Moon Choi , Kwang Soo Kim , Joon Seok Chae , Sung Keun Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Gyunggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Bracewell & Guiliani LLP
- Agent Brad Y. Chin
- Priority: KR10-2010-0056616 20100615
- Main IPC: H05K7/06
- IPC: H05K7/06 ; H05K3/10 ; H05K1/02 ; H05K3/44 ; H05K1/05

Abstract:
Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.
Public/Granted literature
- US20140096380A1 HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-04-10
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