Invention Grant
- Patent Title: Active antenna array heatsink
- Patent Title (中): 有源天线阵列散热器
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Application No.: US14151150Application Date: 2014-01-09
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Publication No.: US09107326B2Publication Date: 2015-08-11
- Inventor: Gerard MacManus , Devadas E. Dorai-Raj , James Dilon Kirchhofer
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01Q1/02

Abstract:
An active array heat sink cooled by natural free convection is disclosed. A long extruded heat sink is partitioned into multiple, shorter zones separated by gaps having horizontal baffles. The gaps and baffles serve to act as air vents and air inlets for the convection currents. As such, the heat transfer for the overall heat sink is improved because hot convection currents are vented and replaced by cool ambient air along the length of the heat sink.
Public/Granted literature
- US20140133094A1 ACTIVE ANTENNA ARRAY HEATSINK Public/Granted day:2014-05-15
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