Invention Grant
US09107333B1 Molded leadframe for PCB-to-PCB connection 有权
用于PCB到PCB连接的成型引线框架

Molded leadframe for PCB-to-PCB connection
Abstract:
A method for making a leadframe includes removing a group of parallel, strip-shaped electrical conductors from a metal sheet, embedding end portions of the conductors in molding compound defining a leadframe body, and separating the conductors from each other, such that portions of the conductors remain encapsulated in the molding compound while other portions remain exterior to the molding compound and define leads of the resulting leadframe.
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