Invention Grant
- Patent Title: Molded leadframe for PCB-to-PCB connection
- Patent Title (中): 用于PCB到PCB连接的成型引线框架
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Application No.: US14188855Application Date: 2014-02-25
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Publication No.: US09107333B1Publication Date: 2015-08-11
- Inventor: Nikolaus W. Schunk
- Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H05K3/36 ; H01R43/16 ; H01R43/24

Abstract:
A method for making a leadframe includes removing a group of parallel, strip-shaped electrical conductors from a metal sheet, embedding end portions of the conductors in molding compound defining a leadframe body, and separating the conductors from each other, such that portions of the conductors remain encapsulated in the molding compound while other portions remain exterior to the molding compound and define leads of the resulting leadframe.
Public/Granted literature
- US20150245501A1 MOLDED LEADFRAME FOR PCB-TO-PCB CONNECTION Public/Granted day:2015-08-27
Information query
IPC分类: