Invention Grant
- Patent Title: Oblique laser beam cutting
- Patent Title (中): 倾斜激光束切割
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Application No.: US12976327Application Date: 2010-12-22
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Publication No.: US09108271B2Publication Date: 2015-08-18
- Inventor: Florian Sepp , Volker Metsch
- Applicant: Florian Sepp , Volker Metsch
- Applicant Address: DE Ditzingen
- Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
- Current Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
- Current Assignee Address: DE Ditzingen
- Agency: Fish & Richardson P.C.
- Priority: DE102008030783 20080628
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/38 ; B23K26/04 ; B23K26/14

Abstract:
A method for oblique laser beam cutting of a workpiece and system for performing the same, in which a supersonic flow of cutting gas discharged from a cutting gas nozzle is orientated at an oblique cutting angle with respect to a surface of a workpiece, and in which the workpiece and the laser beam are moved relative to each other during the oblique laser beam cutting operation. The oblique cutting angle extends along a plane that is perpendicular to a direction of advance. During operation, the position of the laser beam on the workpiece surface is adjusted in such a manner that the laser beam strikes the workpiece surface in a high-pressure region formed within the supersonic flow of the cutting gas.
Public/Granted literature
- US20110120982A1 Oblique Laser Beam Cutting Public/Granted day:2011-05-26
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