Invention Grant
- Patent Title: Multilayer chemical mechanical polishing pad
- Patent Title (中): 多层化学机械抛光垫
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Application No.: US13788594Application Date: 2013-03-07
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Publication No.: US09108290B2Publication Date: 2015-08-18
- Inventor: Angus Repper , Marty W. DeGroot
- Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc. , Dow Global Technologies LLC
- Applicant Address: US DE Newark US MI Midland
- Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.,Dow Global Technologies LLC
- Current Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.,Dow Global Technologies LLC
- Current Assignee Address: US DE Newark US MI Midland
- Agent Thomas S. Deibert
- Main IPC: B24B37/20
- IPC: B24B37/20 ; B24B37/04 ; B24B37/22 ; B24B37/24 ; B32B37/12
Abstract:
A multilayer chemical mechanical polishing pad is provided, having: a polishing layer having a polishing surface, a counterbore opening, a polishing layer interfacial region parallel to the polishing surface; a porous subpad layer having a bottom surface and a porous subpad layer interfacial region parallel to the bottom surface; and, a broad spectrum, endpoint detection window block; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the multilayer chemical mechanical polishing pad has a through opening that extends from the polishing surface to the bottom surface of the porous subpad layer; wherein the counterbore opening opens on the polishing surface, enlarges the through opening and forms a ledge; and, wherein the broad spectrum, endpoint detection window block is disposed within the counterbore opening.
Public/Granted literature
- US20140256230A1 Multilayer Chemical Mechanical Polishing Pad Public/Granted day:2014-09-11
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