An apparatus is configured for sealing a hole in a panel having a first surface on one side of the panel and a second surface on the other side of the panel. The apparatus includes a boot and a seal member. The boot includes a first portion having a first bellows, a second portion having a second bellows, and a third portion that interconnects the first portion and the second portion. The seal member is operatively connected to the third portion of the boot and is configured such that, when the third portion of the boot is within the hole, the seal member contacts the panel to form at least one seal around the hole.