Invention Grant
- Patent Title: Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof
- Patent Title (中): 具有层叠加速度计和磁力计模具的微电子封装及其制造方法
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Application No.: US14197962Application Date: 2014-03-05
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Publication No.: US09108841B1Publication Date: 2015-08-18
- Inventor: Philip H. Bowles , Stephen R. Hooper
- Applicant: Philip H. Bowles , Stephen R. Hooper
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B81C3/00 ; H01L25/00 ; B81C1/00 ; H01L25/16 ; B81B7/00
Abstract:
Methods for fabricating multi-sensor microelectronic packages and multi-sensor microelectronic packages are provided. In one embodiment, the method includes positioning a magnetometer wafer comprised of an array of non-singulated magnetometer die over an accelerometer wafer comprised of an array of non-singulated accelerometer die. The magnetometer wafer is bonded to the accelerometer wafer to produce a bonded wafer stack. The bonded wafer stack is then singulated to yield a plurality of multi-sensor microelectronic packages each including a singulated magnetometer die bonded to a singulated accelerometer die.
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