Invention Grant
- Patent Title: Reducing microelectromechanical systems stiction by formation of a silicon carbide layer
- Patent Title (中): 通过形成碳化硅层来减少微机电系统的粘滞
-
Application No.: US13946729Application Date: 2013-07-19
-
Publication No.: US09108842B2Publication Date: 2015-08-18
- Inventor: Michael D. Turner , Ruben B. Montez
- Applicant: Michael D. Turner , Ruben B. Montez
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent Jonathan N. Geld
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B3/00

Abstract:
A mechanism is provided for reducing stiction in a MEMS device by forming a near-uniform silicon carbide layer on silicon surfaces using carbon from TEOS-based silicon oxide sacrificial films used during fabrication. By using the TEOS as a source of carbon to form an antistiction coating, all silicon surfaces can be coated, including those that are difficult to coat using standard self-assembled monolayer (SAM) processes (e.g., locations beneath the proof mass). Controlled processing parameters, such as temperature, length of time for annealing, and the like, provide for a near-uniform silicon carbide coating not provided by previous processes.
Public/Granted literature
- US20150021717A1 REDUCING MICROELECTROMECHANICAL SYSTEMS STICTION BY FORMATION OF A SILICON CARBIDE LAYER Public/Granted day:2015-01-22
Information query