Invention Grant
- Patent Title: Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
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Application No.: US13658415Application Date: 2012-10-23
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Publication No.: US09109188B2Publication Date: 2015-08-18
- Inventor: William A. Wojtczak , Ma. Fatima Seijo , David Bernhard , Long Nguyen
- Applicant: Advanced Technology Materials, Inc.
- Applicant Address: US CT Danbury
- Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.
- Current Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.
- Current Assignee Address: US CT Danbury
- Agency: Moore & Van Allen, PLLC
- Agent Tristan A. Fuierer; Rosa Yaghmour
- Main IPC: C11D3/30
- IPC: C11D3/30 ; C09K13/00 ; C09K13/08 ; C11D7/10 ; C11D7/26 ; C11D7/28 ; C11D7/32 ; C11D7/34 ; C11D11/00 ; C23F11/14 ; C23G1/10 ; G03F7/42 ; H01L21/02 ; C11D3/32 ; C11D3/33
Abstract:
A semiconductor wafer cleaning formulation, including 1-35% wt. fluoride source, 20-60% wt. organic amine(s), 0.1-40% wt. nitrogenous component, e.g., a nitrogen-containing carboxylic acid or an imine, 20-50% wt. water, and 0-21% wt. metal chelating agent(s). The formulations are useful to remove residue from wafers following a resist plasma ashing step, such as inorganic residue from semiconductor wafers containing delicate copper interconnecting structures.
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