Invention Grant
- Patent Title: Fluid resistance device
- Patent Title (中): 流体阻力装置
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Application No.: US13748506Application Date: 2013-01-23
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Publication No.: US09109736B2Publication Date: 2015-08-18
- Inventor: Hidetaka Yada , Takehisa Hataita , Soutaro Kishida
- Applicant: HORIBA STEC, Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: HORIBA STEC, Co. Ltd.
- Current Assignee: HORIBA STEC, Co. Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Alleman Hall McCoy Russell & Tuttle LLP
- Priority: JP2012-012050 20120124
- Main IPC: G05D7/01
- IPC: G05D7/01 ; F16L55/027 ; G01F1/34

Abstract:
In order to provide a fluid resistance device that is easily manufactured, compact, accurate, and uniform in performance, the fluid resistance device comprises two members that have facing surfaces that face each other and a downstream end of the upstream side flow channel and an upstream end of the downstream side flow channel open at positions displaced from each other on the facing surfaces, and a ring body that is arranged to surround the downstream end opening and the upstream end opening and that forms the fluid resistance channel between the downstream end opening and the upstream end opening by being sandwiched by the facing surfaces, and is so configured that the ring body is made of a material harder than that of each member, and the ring body breaks into the facing surfaces by fastening two members so as to make the facing surfaces approach each other.
Public/Granted literature
- US20130186499A1 FLUID RESISTANCE DEVICE Public/Granted day:2013-07-25
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