Invention Grant
- Patent Title: High resolution large displacement/crack sensor
- Patent Title (中): 高分辨率大位移/裂纹传感器
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Application No.: US13320885Application Date: 2010-05-28
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Publication No.: US09109883B2Publication Date: 2015-08-18
- Inventor: Farhad Ansari , Seyed Asadollah Bassam
- Applicant: Farhad Ansari , Seyed Asadollah Bassam
- Applicant Address: US IL Urbana
- Assignee: The Board of Trustees of The University of Illinois
- Current Assignee: The Board of Trustees of The University of Illinois
- Current Assignee Address: US IL Urbana
- Agency: Reinhart Boerner Van Deuren P.C.
- International Application: PCT/US2010/036571 WO 20100528
- International Announcement: WO2010/138813 WO 20101202
- Main IPC: G01B11/16
- IPC: G01B11/16 ; G01M5/00

Abstract:
A structural displacement sensor that includes an arched member having two ends, where each end is attached to a fastening member. In an embodiment of the invention, the fastening members are configured to be attached to a structure. Further, a strain gauge is attached to the arched member, and the strain gauge is operatively connected to a signal processing device. In an embodiment, the arched member and strain gauge are configured to measure a displacement of the structure based on the amount of strain detected on the strain gauge.
Public/Granted literature
- US20120069324A1 HIGH RESOLUTION LARGE DISPLACEMENT/CRACK SENSOR Public/Granted day:2012-03-22
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