Invention Grant
- Patent Title: Touch module
- Patent Title (中): 触摸模块
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Application No.: US13760059Application Date: 2013-02-06
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Publication No.: US09110548B2Publication Date: 2015-08-18
- Inventor: Chih-Chung Lin
- Applicant: Chih-Chung Lin
- Agency: Nikolai & Mersereau, P.A.
- Agent C. G. Mersereau
- Priority: TW101148211A 20121219
- Main IPC: G06F3/045
- IPC: G06F3/045 ; G06F3/044

Abstract:
A touch module includes a transparent substrate, a shield layer, a touch electrode layer, a transparent insulation layer and a lead layer. The shield layer is coated on the transparent substrate. The touch electrode layer is coated on both the transparent substrate and the shield layer. The transparent insulation layer is disposed on the touch electrode layer and formed with at least one through hole. The lead layer is disposed on the transparent insulation layer and formed with a conduction section positioned in the through hole in electrical connection with the touch electrode layer. Therefore, the lead layer can directly electrically connect with the touch electrode layer through the through hole of the transparent insulation layer. Accordingly, the cost for the optical mask design and the lithographic and etching processes can be saved and the problem that the transparent substrates often fail to fully attach is eliminated.
Public/Granted literature
- US20140166451A1 TOUCH MODULE Public/Granted day:2014-06-19
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