A backlight assembly includes a light-emitting diode (LED) module and a bottom chassis. The LED module includes an LED package in which at least one LED chip is mounted, and first and second wire sockets respectively making contact with lead frames formed at two sides of the LED package. The bottom chassis has a coupling hole formed through a bottom portion for receiving a coupling hook of the LED module. Thus, a wire socket is configured to make contact with a lead frame formed at a side portion of an LED package and power is received through a wire inserted through the wire socket, so that an additional printed circuit board (PCB) or an additional flexible printed circuit board (FPCB) for providing the LED package with power may be omitted.